For Lightweight Thermal Solution Electronic Ceramic Heat Sink

For Lightweight Thermal Solution Electronic Ceramic Heat Sink. High Thermal Conductivity: AlN substrate offers thermal conductivity exceeding 180W/m.K for efficient heat dissipation. Wide Material Options: Available in AlN, 96% Alumina, ZTA, and various metal materials like Au, Sn, Ni, Cu. Custom Engineering Services: Supports custom laser cutting, lapping, polishing, and metallizing services for specific needs. Excellent Insulation Properties: Features high resistivity, low dielectric loss, and superior insulation for electronic safety. Versatile Applications: Ideal for high-frequency equipment, power transistors, LEDs, ICs, and microwave devices. Flexible Thickness Range: Ceramic thickness ranges from 0.15mm to 1.0mm with precise tolerance options. OEM and ODM Support: Full customization available from samples, designs, or full custom specifications. ISO Certified Quality: Manufactured under ISO9000/9002 standards with rigorous raw material testing.