HDI High Tg Multilayer Buried and Blind Via Holes PCB

HDI High Tg Multilayer Buried and Blind Via Holes PCB. One-Stop Service: Comprehensive service covering PCB fabrication, SMT assembly, component sourcing, and function testing. High Precision Capability: Supports 1-48 layers with min inner layer thickness of 0.07mm and min drill size of 0.2mm. Flexible MOQ: Accepts orders starting from 1 piece, supporting both sample and mass production without MOQ. Fast Delivery: PCB production takes 3-8 days, while PCBA assembly requires 10-20 days for completion. Strict Quality Control: 100% functional testing, X-ray inspection, and AOI testing ensure high reliability for all products. Wide Application Scope: Products serve automotive, medical, industrial control, IoT, smart home, and military sectors. Certified Manufacturer: Holds IATF16949, ISO13485, and ISO9001 certifications ensuring professional manufacturing standards. Customization Options: Offers full customization, minor customization, and flexible options based on samples or designs.