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8 Layers PCB, Immersion Gold+OSP PCB, Mobile Communication PCB, Smartphone PCB, HDI Board
InStock Source-listed auditby Shenzhen Boyunfa Technology Co., Ltd.
₹54≈ $0.65 · indicative, confirm with supplier
Supplier information
Description
8 Layers PCB, Immersion Gold+OSP PCB, Mobile Communication PCB, Smartphone PCB, HDI Board, Find Details and Price about PCB Copy Reverse Engineering PCB Service from 8 Layers PCB, Immersion Gold+OSP PCB, Mobile Communication PCB, Smartphone PCB, HDI Board - Shenzhen Boyunfa Technology Co., Ltd.
Specifications
TypeRigid Circuit Board
BrandByfpcba
OriginShenzhen China
ServiceOne-Stop Service
MaterialPaper Phenolic Copper Foil Substrate
TrademarkBYFPCBA
DielectricFR-4
Model NumberPCB
Base MaterialCopper
CertificationRoHS, ISO9001, UL, SGS
Min. Hole Size0.1mm(4mil) for HDI / 0.15mm(6mil)
Board Thickness0.2-6.0mm
