Ultra-Precision Wafer High Speed Grinding and Thinning Equipment

Name: Ultra-Precision Wafer High Speed Grinding and Thinning Equipment
Brand: Shenzhen Ponda Grinding Technology Co.,Ltd.
SKU: pFhAzslVZYcW
Price: 1670000 INR

5.0InStock Source-listed auditby Shenzhen Ponda Grinding Technology Co.,Ltd.

₹16,70,000≈ $20,000 · indicative, confirm with supplier

Payment

L/C, T/T, Western Union, Paypal

Port

Shenzhen, China

Incoterms

FOB, CIF, CFR, EXW

Chat now

Description

Ultra-Precision Wafer High Speed Grinding and Thinning Equipment, Find Details and Price about Wafer Thinning Equipment Grinding Thinning from Ultra-Precision Wafer High Speed Grinding and Thinning Equipment - Shenzhen Ponda Grinding Technology Co.,Ltd.