Thermal Silicone Gel for Filling and Sealing in Consumer Electronics

Thermal Silicone Gel for Filling and Sealing in Consumer Electronics. High Thermal Conductivity: Provides 3.5 W/mK thermal conductivity for efficient heat dissipation in electronics. Low Stress & Thixotropic: Thixotropic paste with low stress application, protecting solder joints and components. Easy 1:1 Mixing: Features 1:1 mixing ratio by weight or volume, compatible with dual cartridge guns. Flexible Customization: Offers flexible customization for viscosity, thermal conductivity, and other properties. RoHS & Halogen Free: Platinum catalyzed, halogen-free, and REACH certified for safety and compliance. OEM/ODM Service: Factory provides OEM and ODM services with market rights protection for partners.