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2K Epoxy Potting Adhesive Low Heat Release During Curing for Packaging Protection of Motors
5.0InStock Source-listed auditby Shanghai Sepna Chemical Technology Co., Ltd.
₹167≈ $2 · indicative, confirm with supplier
Description
2K Epoxy Potting Adhesive Low Heat Release During Curing for Packaging Protection of Motors, Find Details and Price about Potting Compound Epoxy Potting Compound from 2K Epoxy Potting Adhesive Low Heat Release During Curing for Packaging Protection of Motors - Shanghai Sepna Chemical Technology Co., Ltd.
Specifications
ColorBlack
ReachCertificed
Einecs210-898-8
OriginChina
CAS No.9009-54-5
FormulaCH3h8n2o
HS Code3506100090
HardnessShore D 85
MaterialEpoxy
Model NO.SE686
TrademarkSEPNA
ViscosityLow
Morphology
