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Metal Bond Cutting Blade for Wafering and Dicing

Name: Metal Bond Cutting Blade for Wafering and Dicing
Brand: Grinding Wheel Manufacturer, Diamond Grinding Wheels, Diamond Tools Supplier - Zhengzhou Research Institute for Abrasives & Grinding
SKU: nSmEtNBKJUVu
Price: 6680 INR

InStock Source-listed auditby Zhengzhou Research Institute for Abrasives & Grinding

₹6,680≈ $80 · indicative, confirm with supplier

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Supplier information

Grinding Wheel Manufacturer, Diamond Grinding Wheels, Diamond Tools Supplier - Zhengzhou Research Institute for Abrasives & Grinding

Manufacturer/Factory, Trading Company

Audited supplier

Description

Metal Bond Cutting Blade for Wafering and Dicing, Find Details and Price about Metal Bond Diamond Cutting Blade Metal Bond Diamond Dicing Blade from Metal Bond Cutting Blade for Wafering and Dicing - Zhengzhou Research Institute for Abrasives & Grinding

Specifications

KindDiamond Wheel

UsageStone Cutting, Drilling, Engineering Material, Optical Glass Cutting, Lab Use Super-thin Saw Blade, Semiconductor Cutting, Arts Cutting, Fire-Retardant, Porcelain, Plastics, Laminate Plate

Manufacturing ArtsSinter

Saw Blade External Diameter150mm

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Metal Bond Cutting Blade for Wafering and Dicing

Supplier information

Description

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