Silicon Wafer Cleaning Equipment for Semiconductor Processing

Silicon Wafer Cleaning Equipment for Semiconductor Processing. Multi-stage Cleaning Process: Removes micron particles, metal ions, and organic matter using ultrasonic, acid, alkaline, and rinsing methods. Automated PLC Control: Flexible adjustment of temperature, time, and power for monocrystalline and polycrystalline silicon materials. Energy-Saving Design: Overflow circulation filtration reduces water consumption; water-based agents replace chemical solvents. Dual Frequency Options: Ultrasonic cleaning available at 28kHz or 40kHz to suit different processing needs. High Capacity Range: Supports processing volumes from 38ml up to 1500ml in a single cycle. 1-Year Warranty: Comprehensive 1-year warranty coverage for all mechanical equipment. Fast Lead Time: Peak and off-peak season lead times both within 15 working days.