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Custom Flexible PCB Electrical Insulation Polyimide Film for Flex Printed Circuit Board Providing Assembly Services
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Description
Model NO.: YH-SDFC0150 Structure: Multilayer FPC Material: Polyimide Combination Mode: Without Adhesive Flexible Plate Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Consumer Electronics Conductive Adhesive: Conductive Silver Paste
Specifications
Layers3-Layer
OriginChina
HS Code853890
MaterialPolyimide
Model NO.YH-SDFC0150
StructureMultilayer FPC
SubstratePolyimide +Pi/Fr4 Reinforced Steel Sheet
TrademarkYH
ApplicationDigital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Consumer Electronics
Base MaterialCopper
Specificationcustom size
Plate Thickness0.12+/-0.03mm
