
Ultra-Strong Diamond Slotting Wheel for Efficient Material Cutting. Porous Metal Bond Technology: Self-developed technology enabling superior chip capacity and self-sharpening properties. Ultra-High Grinding Speed: Capable of ultra-high speed grinding up to 200-300m/s for heavy load applications. Extended Tool Life: Improves tool life by 35% compared to traditional diamond grinding tools. Reduced Sharpening Frequency: Significantly reduces sharpening and trimming frequency, sometimes eliminating the need. Low Power Loss: Lower power loss and grinding temperature compared to traditional products. Full Customization Available: Offers full customization, minor customization, and flexible customization options. High Abrasive Concentration: Ultra-high abrasive concentration not limited by traditional process constraints.