Precision Pre-Ground Grey Tungsten TIG Electrode 1.0 0.04" for Semiconductor Etching

Precision Pre-Ground Grey Tungsten TIG Electrode 1.0 0.04" for Semiconductor Etching. Longitudinal Grinding Direction: Ensures stable arc, precision tip, and longer service life. Smooth Mirror Finish: Prevents instability caused by coarse grinding, ensuring consistent welds. Customizable Specifications: Tailored angles, tip diameter, length, and tip shape available. Multi-Angle Options: Available in 15, 20, 25, 30, 35, 40, 45, 50, 60, 90, 120, 180 degrees. Versatile Head Types: Offers Arc, Flat, and Pointed head configurations. Factory Direct Pricing: Competitive wholesale prices with high quality and value. Broad Industry Application: Ideal for aerospace, medical, automotive, and semiconductor manufacturing.