Digital Control Hot Bar Reflow Soldering Equipment for Micro-Gap FPC Bonding

Name: Digital Control Hot Bar Reflow Soldering Equipment for Micro-Gap FPC Bonding
Brand: Dongguan Mingrui Technology Co., Ltd.
SKU: kugREMhbarVH
Price: 501000 INR

5.0InStock Source-listed auditby Dongguan Mingrui Technology Co., Ltd.

₹5,01,000≈ $6,000 · indicative, confirm with supplier

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Description

Digital Control Hot Bar Reflow Soldering Equipment for Micro-Gap FPC Bonding. Rapid heating & rapid cooling pulse design, minimal thermal damage to FPC/FFC flexible substrate. Closed-loop real-time temperature control, multi-segment temperature curve setting. High-precision servo/cylinder pressure control, stable pressure output. ine-pitch bonding capability, support 0.2mm small pitch FPC & flat cable. Simultaneous welding for a row of solder points, high production consistency. eplaceable molybdenum / titanium alloy hot-bar tip, easy maintenance.