High Bond PU Foam for Fixing Insulation Boards

High Bond PU Foam for Fixing Insulation Boards. One-Component Moisture Curing: Professional-grade foam expands to fill gaps and cures with moisture for a durable seal. High Thermal Insulation: Insulation factor of 0.044 Mw/m.k provides excellent thermal and sound insulation performance. Strong Adhesion: Adheres to most common building materials with adhesive strength of 90 kPa. Eco-Friendly Formula: Contains no ozone-depleting propellants, SCCPs, or formaldehyde; verified by SGS. OEM Customization Available: Supports formula adjustment, specification revision, private labeling, and custom packaging. Fast Tack-Free Time: Becomes dust-free in 12-14 minutes and cuttable within 45-55 minutes. Mold and Water Resistant: Mold-resistant and water-resistant properties ensure long-term durability in various environments.