Huineng Hn-558 One-Component Neutral Cure Silicone Sealant Adhesive for Electronics Industrial Bonding High Dielectric Strength

Huineng Hn-558 One-Component Neutral Cure Silicone Sealant Adhesive for Electronics Industrial Bonding High Dielectric Strength. Excellent waterproofing, shock resistance, high temperature resistance, electrical insulation, and aging resistance. Non-corrosive to glass, metal and some plastics, with good adhesion and sealing performance. Non-toxic, non-corrosive, and compliant with RoHS environmental requirements. Natural cure, good flexibility, with a temperature range of -40 degree to 80 degree.