Polyurethane Potting Adhesives with Balanced Electrical Insulation and Thermal Conductivity for Sensor Encapsulation

Polyurethane Potting Adhesives with Balanced Electrical Insulation and Thermal Conductivity for Sensor Encapsulation. Balanced Insulation & Thermal Conductivity: Offers excellent electrical dielectric performance with 0.55 W/m.K thermal conductivity for effective heat dissipation. High Adhesion to Metals and Plastics: Exhibits strong bonding strength to most metals and plastics, with shear strength up to 6.5 MPa on aluminum. Flame Retardant UL-94 V-0 Certified: Contains flame retardant additives achieving UL-94 V-0 rating, ensuring safety in sensitive electronic applications. Excellent Low-Temperature and Aging Resistance: Maintains stability and performance under low-temperature conditions and long-term aging without volume change. Flexible and Low Shrinkage: Cures into a flexible resin with 85% elongation and minimal curing shrinkage of 1.0%, reducing stress on components. Solvent-Free Two-Component System: Based on polyurethane with an 85:15 mix ratio, providing a solvent-free solution for environmental protection.