Clean Grade Tailored Machining for Semiconductor Tool Component Assembly

Clean Grade Tailored Machining for Semiconductor Tool Component Assembly. Customized Dimensions and Interfaces: Size, interface, and wall thickness are fully customizable based on customer drawings. Customized Surface Color and Finish: Surface color, shot blasting, powder coating, and anti-corrosion treatments are tailored to needs. ISO9001 Quality Management: All assembly activities strictly follow ISO9001 quality management standards. High Precision Machining: Metal machining tolerance as tight as +/-0.003mm with surface roughness Ra 0.1~3.2. Heavy Load Assembly Capability: Equipped with 50-ton lifting capacity and heavy load jigs for oversized structural modules. Comprehensive Post-Assembly Protection: Offers stress relief, anti-corrosion, and surface finishing for harsh working environments. 100% Finished Product Inspection: Visual and functional inspection performed on all finished products before shipment. Flexible Lead Time: Delivery within 15-30 working days, adaptable for mass orders and custom projects.