IC Silicon Wafer Chamfering Machine High Precision

IC Silicon Wafer Chamfering Machine High Precision. High Precision Control: Precisely controls chamfer angle, size, and surface roughness with CNC system. Wide Wafer Compatibility: Processes various wafer sizes from 3 to 6 inches with different materials. Adjustable Grinding Speed: Grinding speed ranges from 1mm/S to 50mm/S for flexible processing. Semi-Automatic Operation: Requires only manual loading and unloading; grinding is fully automatic. 1 Year Warranty Coverage: Includes comprehensive warranty protection for one year from purchase. Global Certification: Certified with GS, CE, and ISO standards for international safety compliance. Fast Lead Time: Average lead time is within 15 workdays for both peak and off-peak seasons.