Polyurethane Thermal Potting Solutions for High-Power-Density Electronic Modules

Polyurethane Thermal Potting Solutions for High-Power-Density Electronic Modules. High Thermal Conductivity: Thermal conductivity of 0.55 W/m.K for efficient heat dissipation in high-power modules. UL-94 V-0 Flame Retardant: Contains flame retardant additives achieving UL-94 V-0 rating for enhanced safety. Excellent Dielectric Strength: Provides stable electrical insulation with 20 kV/mm dielectric strength. Flexible & Strong Adhesion: Flexible casting resin with high shear strength (6.5 MPa on Al) and good adhesion to metals/plastics. Low Viscosity & Fast Cure: Low viscosity (600-1200 mPa.s) allows easy processing with pot life of 15 mins and fast curing. Solvent-Free Composition: Two-component polyurethane resin that is solvent-free and exhibits no volume change after curing. Specialized Automotive Application: Specifically formulated for automotive sensors, switches, and transformers requiring environmental protection.