
Self-Sharpening Diamond Powder for Resin Bond Diamond Tool. Self-Sharpening Capability: Polycrystalline-like structure maintains sharp cutting edges and consistency during use. High Polishing Accuracy: Small cutting edges significantly reduce Ra value and prevent deep scratches on workpieces. Strong Cutting Force: Sharp edges provide cutting force 2-4 times higher than single crystal diamond powder. Wide Mesh Size Range: Available from US Mesh 60/80 to 325/400 and micron sizes 0.05um to 60um. High Purity Grade: Purity reaches 99.9% with controlled particle size distribution and shape. Versatile Material Application: Ideal for cemented carbide, glass, ceramics, stone, and semiconductor materials. Fast Delivery Time: Standard delivery within 3-5 business days for most orders. Advanced Quality Control: ISO9001 certified with topography analysis and laser particle size analyzers.