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Semiconductor Wafer Edge Rounding Machine for IC Industry
5.0InStock Source-listed auditby Nanjing Bangwin Thermal Equipment Co., Ltd.
₹5,84,500≈ $7,000 · indicative, confirm with supplier
Payment
LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
Incoterms
FOB, EXW, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, Others, FCA
Description
Semiconductor Wafer Edge Rounding Machine for IC Industry. High Precision Control: Precisely controls chamfer angle, size, and surface roughness with CNC system. Wide Wafer Compatibility: Processes various wafer sizes from 3 to 6 inches and different materials. Adjustable Grinding Speed: Grinding speed ranges from 1mm/S to 50mm/S for versatile processing needs. Semi-Automatic Operation: Requires only manual loading and unloading; grinding is fully automatic. 1-Year Warranty Coverage: Includes comprehensive warranty protection for the entire machine. Multiple Certifications: Certified with GS, CE, and ISO standards for safety and quality. Fast Lead Time: Average lead time is within 15 workdays regardless of season.
Specifications
Warranty1 Year
AutomaticAutomatic
Model NO.bw
CustomizationAvailable
After-sales ServiceAvailable
