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CategoriesElectrical & ElectronicsThermal Interface MaterialsThermal PadHn-TCP-300 Find Similar Iconultra-Low Hardness Thermal Pad with 3.0 W/ M. K Thermal Conductivity Gap Filler Insulating Pad for Memory Storage Module

Hn-TCP-300 Find Similar Iconultra-Low Hardness Thermal Pad with 3.0 W/ M. K Thermal Conductivity Gap Filler Insulating Pad for Memory Storage Module

Name: Hn-TCP-300 Find Similar Iconultra-Low Hardness Thermal Pad with 3.0 W/ M. K Thermal Conductivity Gap Filler Insulating Pad for Memory Storage Module
Brand: Guangdong Huineng Silicone Products Co. Ltd
SKU: iPUrRqsgJpcz
Price: 42 INR

5.0InStock Source-listed auditby Guangdong Huineng Silicone Products Co. Ltd

Description

Hn-TCP-300 Find Similar Iconultra-Low Hardness Thermal Pad with 3.0 W/ M. K Thermal Conductivity Gap Filler Insulating Pad for Memory Storage Module. Low viscosity,thermal conductivity ,0.8~12w/m.k,thickness 0.1~18mm.Can absorb 0.2mm structural tolerance to reduce processing costs for diverse application scenariosood. Highly compressible, soft & elastic; natural tackiness, no extra adhesive needed. Durable & reliable.