Diamond Grinding Polishing Machine/Optical Glass Grinding Tool. High Precision Polishing: Achieves planar processing accuracy of RMS 0.135um and surface roughness Rz 0.05. Dual-Sided Processing: Designed for simultaneous double-sided grinding and polishing of hard, brittle materials. Frequency Conversion Control: Motors allow smooth acceleration, deceleration, and reversal to prevent workpiece breakage. Advanced PLC System: Touchscreen panel enables easy parameter setting and fully automated process execution. Durable Gear Structure: Pin tooth structure with stainless steel sleeves ensures rust-proof, wear-resistant, long life. Adjustable Pressure Control: Precision electrical proportional valve allows accurate setting of processing pressure. Wide Material Compatibility: Suitable for silicon wafers, quartz, optical glass, sapphire, and semiconductor materials. Safety Protection Design: Safety device prevents upper disc sudden falling during lifting operations.