Semiconductor IC Wafer Grinding Equipment for Production Line

Semiconductor IC Wafer Grinding Equipment for Production Line. AC Variable Frequency Drive: Ensures smooth start and stop for reliable operation. Four Pressure Levels: Includes light, medium, heavy, and finishing pressure options. CNC Control Method: Allows direct input of motor speed and running time. Adjustable Grinding Disc: Freely raises and lowers with manual adjustment for stability. Slow-Descent Cylinder: Prevents breakage of thin workpieces with independent pressure control. Electronic Preset Counter: Accurately controls grinding revolutions and desired results. Diamond Dressing Wheels: Available for disc dressing to maintain precision. Large-Size Drive Shaft: Enhances rigidity to eliminate vibrations.