IC Wafer Surface Grinding Machine for Precision Processing

Name: IC Wafer Surface Grinding Machine for Precision Processing
Brand: Nanjing Bangwin Thermal Equipment Co., Ltd.
SKU: hYTrUnEXvwVl
Price: 542750 INR

5.0InStock Source-listed auditby Nanjing Bangwin Thermal Equipment Co., Ltd.

₹5,42,750≈ $6,500 · indicative, confirm with supplier

Payment

LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram

Incoterms

FOB, EXW, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, Others, FCA

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Description

IC Wafer Surface Grinding Machine for Precision Processing. AC Variable Frequency Drive: Ensures smooth start and stop for reliable operation. Four Pressure Levels: Light, medium, heavy, and finishing for versatile grinding. CNC Control Method: Allows direct input of motor speed and running time. Adjustable Grinding Disc: Freely raised/lowered with manual adjustment for stability. Slow-Descent Cylinder: Prevents breakage of thin workpieces with independent pressure. Electronic Preset Counter: Accurately controls grinding revolutions and results. Diamond Dressing Wheels: Available for precise disc dressing and maintenance. Rigid Drive Shaft Design: Large-size design eliminates vibration for high precision.