
| Type | Laser Brazing Machine |
| PCB Size | Max 570×450mm Min 10×10mm |
| Model NO. | JM-WDS-620 |
| Customization | Available |
| PCB Thickness | 0.3-8mm |
Efficient BGA Rework Station for Customizable Chip Repair Needs. Powerful Dual Heating System: Combines 4200W far-infrared bottom heating with 1600W hot air top and bottom heating for efficient rework. Customizable Chip Handling: Supports customizable chip sizes up to 100x100mm and handles chips weighing up to 150g. Trusted Manufacturer: Leading SMT supplier in China with 26 patents, serving major clients like Canon and BYD.
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