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IC Silicon Wafer Thinning Machine High Precision
5.0InStock Source-listed auditby Nanjing Bangwin Thermal Equipment Co., Ltd.
₹5,42,750≈ $6,500 · indicative, confirm with supplier
Payment
L/C, T/T, D/P, Western Union, Paypal, Money Gram
Port
Shanghai, China
Incoterms
FOB, EXW, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, Others, FCA
Description
IC Silicon Wafer Thinning Machine High Precision, Find Details and Price about Double Side Lapping Machine Double Side Grinding Machine from IC Silicon Wafer Thinning Machine High Precision - Nanjing Bangwin Thermal Equipment Co., Ltd.
Specifications
TypeDouble Side Lapping Machine
OriginChina
AbrasivesGrinding Wheel
ConditionNew
Model NO.bw
PrecisionHigh Precision
TrademarkN/A
Power (Kw)5.5
Weight (Kg)1800
Package Size100.00cm * 100.00cm * 100.00cm
CertificationGS, CE, RoHS, ISO 9001
Specification1700*1300*2170(mm)
