Loading…
Semiconductor Wafer Grinding Machine for Ultra Thin Wafer
5.0InStock Source-listed auditby Nanjing Bangwin Thermal Equipment Co., Ltd.
₹5,42,750≈ $6,500 · indicative, confirm with supplier
Payment
L/C, T/T, D/P, Western Union, Paypal, Money Gram
Port
Shanghai, China
Incoterms
FOB, EXW, CFR, CIF, DAT, FAS, DDP, DAP, CIP, CPT, Others, FCA
Description
Semiconductor Wafer Grinding Machine for Ultra Thin Wafer, Find Details and Price about Semiconductor Wafer Grinding Machine Silicon Wafer Grinding Machine from Semiconductor Wafer Grinding Machine for Ultra Thin Wafer - Nanjing Bangwin Thermal Equipment Co., Ltd.
Specifications
OriginChina
Voltage380V
ConditionNew
Model NO.bw
TrademarkN/A
Power (Kw)1.5
ApplicationMetal Coil
Weight (Kg)600
Package Size100.00cm * 100.00cm * 100.00cm
CertificationISO, CE
Specification700*950*1950mm
Control MethodCNC
