Loading…
Metal-Filled Via-in-Pad (VIP) for High Thermal Dissipation Copper Paste & Sintered Silver Hybrid Direct Cooling Path for Power Amplifiers
5.0InStock Source-listed auditby Fastline Circuits Co., Limited
Description
Metal-Filled Via-in-Pad (VIP) for High Thermal Dissipation Copper Paste & Sintered Silver Hybrid Direct Cooling Path for Power Amplifiers, Find Details and Price about Metal-Filled Via-in-Pad (VIP) from Metal-Filled Via-in-Pad (VIP) for High Thermal Dissipation Copper Paste & Sintered Silver Hybrid Direct Cooling Path for Power Amplifiers - Fastline Circuits Co., Limited
Specifications
LayersMultilayer
OriginShenzhen, China
HS Code8534009000
ConditionUsed
Lead Time12-20 Days
Model NO.PCB
PCB Layer1-26 Layers
TrademarkFastline
CustomizedCustomized
PCB ServiceOne Stop Service
Silk ScreenWhite
Solder MaskGreen
