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Thermal Conductivity 2.0 W/M· K Fast Cure Potting Compound Ensures Efficient Heat Dissipation for Electronic Components
InStock Source-listed auditby ShenZhen DuBang Technology Co., Ltd.
₹88≈ $1.05 · indicative, confirm with supplier
Supplier information
Description
Thermal Conductivity 2.0 W/M· K Fast Cure Potting Compound Ensures Efficient Heat Dissipation for Electronic Components, Find Details and Price about Two-Component Potting Potting Sealant from Thermal Conductivity 2.0 W/M· K Fast Cure Potting Compound Ensures Efficient Heat Dissipation for Electronic Components - ShenZhen DuBang Technology Co., Ltd.
Specifications
ColorGrey
OriginChina
Part BBlack Color
Part aWhite Color
HS Code3921909090
MaterialSilicone
Mix Ratio1:1 by Weight
TrademarkDoBon
ApplicationElectrical Insulation, Fire Barrier, Thermal Insulation
Specification1kg/5kg/10kg/20kg drum
Thermal RatingUL 94
Maximum Voltage10KV~19KV
