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High Speed and Precision Equipment for High Binding Force Applications
InStock Source-listed auditby Suzhou Bozhon Semiconductor Co., Ltd
₹2,08,75,000≈ $250,000 · indicative, confirm with supplier
Supplier information
Description
High Speed and Precision Equipment for High Binding Force Applications, Find Details and Price about Die Bonding Die Bonder from High Speed and Precision Equipment for High Binding Force Applications - Suzhou Bozhon Semiconductor Co., Ltd
Specifications
TypeHigh-speed Chip Mounter
SpeedMedium Speed
Wafer6 Inch, Supports up to 4 Piece
Nozzle12 Nozzles Per Single Head, Dynamictool Chan
OriginChina
Warranty12 Months
ConditionNew
Model NO.DU9821
PrecisionHigh Precision
TrademarkSuzhou Bozhon Semiconductor Co
Workbench2
CertificationISO, CE
