OEM Multi Layer High Tg Immersion Gold Fr4 PCB Board for Electronics Product Project

OEM Multi Layer High Tg Immersion Gold Fr4 PCB Board for Electronics Product Project. Advanced Via Technology: Features blind/buried vias, HDI micro vias, and via-in-pad with conductive filling. Heavy Copper Options: Capable of manufacturing heavy-copper boards up to 12oz thickness. Fast Delivery Service: Offers express 12-hour and 24-hour PCB build time for urgent projects. Comprehensive PCBA Service: Provides full turnkey assembly including fabrication, procurement, and assembly. Strict Quality Standards: Manufactured to UL and IPC standards using state-of-the-art laser drills and LDIs. Wide Material Selection: Processes FR4, Rogers, Isola, PTFE, ceramics, and aluminum/copper base materials. High Precision Specs: Min line width 0.075mm, min hole size 0.1mm, and board thickness up to 6.5mm.