Customizable BGA Rework Station for Enhanced PCB Repair Efficiency

Description

Customizable BGA Rework Station for Enhanced PCB Repair Efficiency. 8-Axis Linkage System: Independent 8-axis linkage for precise positioning and alignment. Triple Heating Method: Top hot air, bottom hot air, and bottom infrared preheating for uniform heating. Full-Automatic Alignment: High-definition industrial camera ensures precise chip placement. Wide Chip Compatibility: Supports BGA, POP, CCGA, QFN, CSP, LGA, and other chip types. Flexible Customization: Offers full, minor, and design-based customization options. Advanced Control System: Industrial all-in-one PC integrated with PLC and touchscreen. Nitrogen Interface: Available nitrogen interface for enhanced soldering quality.