Loading…
Heat Insulation Materia Kiln Backing Insulation Ceramic Fiber Board
5.0InStock Source-listed auditby Shenzhen Keruomei Electronics Co., Ltd.
₹501≈ $6 · indicative, confirm with supplier
Payment
T/T, Western Union, Money Gram
Port
Shenzhen, China
Incoterms
FOB, CIF, EXW, CFR
Description
Heat Insulation Materia Kiln Backing Insulation Ceramic Fiber Board, Find Details and Price about Ceramic Fiber Board Ceramic from Heat Insulation Materia Kiln Backing Insulation Ceramic Fiber Board - Shenzhen Keruomei Electronics Co., Ltd.
Specifications
OriginShenzhen
MaterialAluminum Silicate
Model NO.HZ-1260
TrademarkCustomized
Package Size126.00cm * 106.00cm * 36.00cm
Density Kg/M3250 300 400
Specification1000x1200mm/600x1200mm
Transport Package1100X1300mm/700X1300mm
Package Gross Weight112.000kg
Operating Temperature1600
Heatconductivity(W/M?K)0.1
Linear Shrinkage (9)*Sh
