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Heat-Insulated Epoxy Resin Material Laminated Fr-4/G10 Plate for PCB Insulator
InStock Source-listed auditby Kunshanshi Honglei Electronics Technology Co., Ltd.
₹84≈ $1 · indicative, confirm with supplier
Supplier information
Thermal Insulation Board Manufacturer, Gpo-3 Insulation Board, Fiberglass Mat Supplier - Kunshanshi Honglei Electronics Technology Co., Ltd.
Manufacturer/Factory, Trading Company
Description
Heat-Insulated Epoxy Resin Material Laminated Fr-4/G10 Plate for PCB Insulator, Find Details and Price about PCB Board Insulation Laminated Sheet from Heat-Insulated Epoxy Resin Material Laminated Fr-4/G10 Plate for PCB Insulator - Kunshanshi Honglei Electronics Technology Co., Ltd.
Specifications
TypeInsulation Sheet
BrandHonglei
ColorYellow, Aqua, Black
OriginChina
Density2
HS Code3223962027
MaterialFiberglass Fabric, Epoxy Resin
ChemistryHybrid Insulation
Model NO.G10
Thickness0.1-100mm
TrademarkHonglei
ApplicationInsulators, Electrical Winding Insulation, Winding Wire Coating Insulation, Electrical Base, Shell, Motor, Insulating Varnish, Switch Baseplate
