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New Horizontal Automatic High Speed CNC Silicon Wafer Thinning Machine
5.0InStock Source-listed auditby Shenzhen Ponda Grinding Technology Co.,Ltd.
₹16,70,000≈ $20,000 · indicative, confirm with supplier
Payment
Description
New Horizontal Automatic High Speed CNC Silicon Wafer Thinning Machine, Find Details and Price about Wafer Thinning Silicon Wafer Thinning Machine from New Horizontal Automatic High Speed CNC Silicon Wafer Thinning Machine - Shenzhen Ponda Grinding Technology Co.,Ltd.
Specifications
TypeSurface Grinding Machine
ClassThinner
OriginChina
ServiceOversea Setup & After-Sale Avalaible
AbrasiveRecyclable Water & Grinding Wheel
AbrasivesGrinding Wheel
ConditionNew
Model NO.YM-300WH
PrecisionHigh Precision
TrademarkPONDA
ApplicationGrinding Industry
Package Size1500.00cm * 700.00cm * 1650.00cm
