Connection Form: Wafer Structure: Centre Sealing Seal Form: Auto Sealed Work Pressure: Low Pressure (Pn<1.6mpa) Working Temperature: Normal Temperature (-40°C<T<120°C) Material of Seal Surface: Soft Sealed
Specifications
HS Code8481804090
Seal FormAuto Sealed
StructureCentre Sealing
Work PressureLow Pressure (Pn<1.6mpa)
Connection FormWafer
Size: 45mm-340mmAir Supply: 2bar-8bar
Working TemperatureNormal Temperature (-40°C<T<120°C)