Metalized Electronic Ceramics Ausn Aln Ceramic Submount Heat Sink

Metalized Electronic Ceramics Ausn Aln Ceramic Submount Heat Sink. High Thermal Conductivity: ALN substrate offers thermal conductivity exceeding 180W/m.K for efficient heat dissipation. Excellent Insulation Properties: Features high resistivity, low dielectric loss, and superior insulation for electronic safety. Customized Standard Options: Standard specifications are fully customizable to meet specific client design requirements. Wide Application Range: Ideal for high-frequency equipment, power transistors, LED, IC products, and laser-semiconductor devices. Multiple Material Choices: Available in AlN, 96% Alumina, ZTA, and various metal materials like Au, Sn, Ni, and Cu. Precision Engineering Services: Provides custom engineering solutions including lasering, lapping, polishing, and metallizing. ISO Certified Quality: Manufactured under ISO9000/ISO9002 systems with advanced quality-checking methods. OEM and ODM Support: Full customization available from samples, designs, or full customization services.