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Ceramic Chip High Speed Precise Lapping Machine
5.0InStock Source-listed auditby Shenzhen Ponda Grinding Technology Co.,Ltd.
₹16,70,000≈ $20,000 · indicative, confirm with supplier
Payment
L/C, T/T, Western Union, Paypal
Port
Shenzhen, China
Incoterms
FOB, CIF, CFR, EXW
Description
Ceramic Chip High Speed Precise Lapping Machine, Find Details and Price about Wafer Thinner Precision Grinding from Ceramic Chip High Speed Precise Lapping Machine - Shenzhen Ponda Grinding Technology Co.,Ltd.
Specifications
TypeSurface Grinding Machine
ClassThinner
OriginChina
ServiceOversea Setup & After-Sale Avalaible
AbrasiveRecyclable Water & Grinding Wheel
AbrasivesGrinding Wheel
ConditionNew
Model NO.FD-200A
PrecisionHigh Precision
TrademarkPONDA
ApplicationSemiconductor Industry
Package Size1200.00cm * 1250.00cm * 2050.00cm
