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Xiamen Rongxufeng Technology Co., Ltd.
Fujian, China
Audited supplier
Description
Lqfp Series Black Plastic Organizer Memory Packaging Storage Container High Temperature Electronic IC Component Tray, Find Details and Price about Chip Tray High Temperature Tray from Lqfp Series Black Plastic Organizer Memory Packaging Storage Container High Temperature Electronic IC Component Tray - Xiamen Rongxufeng Technology Co., Ltd.
Specifications
ColorBlack (Custom Colors Available)
UsageCombustible & Explosive Area, Computer Room, Electronic Component Maintenance Room, Printing Workshop, SMT Production Line
OriginHebei, China
MaterialPVC
Model NO.Chip Tray
StructureBottom Grid Reinforcement, Multi-Grid Partition De
TrademarkRongxufrng
Package Size20.00cm * 20.00cm * 2.00cm
Specification23*23mm, Customizable
CertificationsSGS, RoHS, CE
Transport PackageProtective EPE Foam Is Included Inside The Carton.
