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The Eutectic Machine Function Module Can Be Optionally Equipped with Flip Chip
InStock Source-listed auditby Suzhou Bozhon Semiconductor Co., Ltd
₹83,50,000≈ $100,000 · indicative, confirm with supplier
Supplier information
Description
The Eutectic Machine Function Module Can Be Optionally Equipped with Flip Chip, Find Details and Price about Die Bonder Die Bonding from The Eutectic Machine Function Module Can Be Optionally Equipped with Flip Chip - Suzhou Bozhon Semiconductor Co., Ltd
Specifications
TypeHigh-speed Chip Mounter
SpeedHigh Speed
Nozzle12 Nozzles Per Head, with Dynamic Tool Change
OriginChina
Weights2200kg
Warranty12 Months
ConditionNew
Model NO.EH9721
PrecisionHigh Precision
TrademarkSuzhou Bozhon Semiconductor Co
CertificationISO, CE
Specification1900mm*1100mm*1800mm
