Silicon Wafer Surface Grinding Machine for Semiconductor Fab

Silicon Wafer Surface Grinding Machine for Semiconductor Fab. High Precision CNC Control: CNC control method with variable frequency speed control and electronic preset counter for accurate results. Smooth Variable Frequency Drive: AC variable frequency motor ensures soft start and soft stop for smooth and reliable operation. Multi-Level Pressure System: Features four pressure levels: light, medium, heavy, and finishing for versatile grinding needs. Anti-Breakage Design: Separate slow-descent cylinder prevents breakage of thin and brittle workpieces with independent pressure control. High Rigidity Drive Shaft: Large-size drive shaft design enhances rigidity to eliminate vibrations caused by insufficient strength. Diamond Dressing Capability: Supports diamond dressing wheels for effective grinding disc maintenance and dressing. CE and ISO Certified: Meets international safety and quality standards with CE and ISO certifications. 1-Year Warranty Coverage: Comprehensive 1-year warranty provided for the new condition equipment.