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High Precision Semiconductor Laser Cutting Machine for Thin Glass & Wafer Processing
5.0InStock Source-listed auditby Chanxan (Changshu) Laser Technology Co., Ltd.
₹59,28,500≈ $71,000 · indicative, confirm with supplier
Payment
Description
High Precision Semiconductor Laser Cutting Machine for Thin Glass & Wafer Processing, Find Details and Price about Semiconductor Glass Laser Machine Thin Wafer Laser Machine from High Precision Semiconductor Laser Cutting Machine for Thin Glass & Wafer Processing - Chanxan (Changshu) Laser Technology Co., Ltd.
Specifications
OriginSuzhou
Model NO.CS-0605-V-A
TrademarkCHANXAN
Focus Spot≤20um
Laser TypeUltrafast Picosecond Laser
ApplicationAerospace Industry, Automotive Industry, Semiconductor Wafer & IC Packaging Glass
Laser Power10W/30W/35W
Power SupplyThree-Phase 380V AC, 50Hz, 60Hz 20A
Working Area500*610mm
CertificationCE
Specification2200*1500*1750mm
Cooling System
