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Multilayer Mobile Phone Enig Gold PCB with 2oz Copper
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Description
Model NO.: MP-01 Structure: Multilayer Rigid PCB Dielectric: FR-4 Application: Communication Flame Retardant Properties: V0 Base Material: Copper
Specifications
Layer4 Layers
OriginChina
HS Code8501109990
Model NO.MP-01
StructureMultilayer Rigid PCB
DielectricFR-4
ApplicationCommunication
CertificateUL, RoHS
Base MaterialCopper
Min Hole Size0.2mm
Board Thickness1.0mm+/-0.1mm
Copper Thickness1oz
