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Advanced Multi-Layer Heating Device for Optimal Curing Performance
4.0InStock Source-listed auditby Hols (Suzhou) Automation Co., Ltd.
₹30,06,000≈ $36,000 · indicative, confirm with supplier
Payment
L/C, T/T, Money Gram
Port
Shanghai, China
Incoterms
FOB, CIF, CFR, EXW
Description
Advanced Multi-Layer Heating Device for Optimal Curing Performance, Find Details and Price about Multi-Layer Heating Device Superior Curing Device from Advanced Multi-Layer Heating Device for Optimal Curing Performance - Hols (Suzhou) Automation Co., Ltd.
Specifications
OriginChina, Jiangsu
Model NO.Curing Oven
TrademarkHOLS
Cleanliness1000 Grade
Package Size250.00cm * 180.00cm * 200.00cm
SpecificationCustomized
Temperature Range40-500 ℃
Transport PackageWooden Case
Package Gross Weight2850.000kg
Whether to CustomizeCustomized
Temperature Resolution0.1℃
Temperature Uniformity
