Clear room temperature/heat curing electronic potting protecting epoxy potting encapsulation sealant

Clear room temperature/heat curing electronic potting protecting epoxy potting encapsulation sealant. Clear epoxy potting adhesive is a room temperature/heat curing epoxy resin adhesive. This two-component epoxy adhesive is designed for potting, protecting electronic products that require high strength or confidentiality. epoxy potting adhesives cure without heat. After thoroughly mixing component A and component B by weight ratio, the product cures within a certain time to form protection. This product is a transparent color epoxy potting material Resistant to moisture, dirt and other atmospheric components High strength, excellent adhesion, cracking resistance, toughness. With secret acting, no solvent, no curing byproducts Stable mechanical and electrical properties at -45-90 degree. Suitable for hard light strip, display module, photoelectric sensor, smart water meter and other photoelectric display devices and products.