Model NO.: D671X/J Connection Form: Wafer Structure: Single-Eccentric Sealing Seal Form: Auto Sealed Work Pressure: Low Pressure (Pn<1.6mpa) Working Temperature: Medium Temperature (120°C<T<450°C)
Specifications
Model NO.D671X/J
Seal FormAuto Sealed
StructureSingle-Eccentric Sealing
Dn: 2"-48"Pn: 0.6mpa-1.6mpa
ApplicationIndustrial Usage, Water Industrial Usage
Work PressureLow Pressure (Pn<1.6mpa)
Connection FormWafer
Working TemperatureMedium Temperature (120°C<T<450°C)