
Desktop Precision Flat Surface Lapping Machine Equipped for Diamond Slurry Grinding. Simultaneous Double-Side Grinding: Grinds both surfaces uniformly with diamond grinding wheels for high efficiency. German Siemens Electrical System: Features frequency converters, controllers, and PLCs from Siemens for safety. Intelligent Thickness Detection: Uses Japanese SONY system with 0.0005mm resolution for optimal accuracy. Customizable Solutions: Supports customized solutions and free sample making for evaluation. Constant Temperature Cooling: Ensures consistent processing accuracy through a constant temperature environment. Lifetime Maintenance Support: Provides lifetime maintenance and lifelong free upgrades for the equipment. Versatile Material Processing: Processes carbide, ceramics, metals, plastics, graphite, and magnetic materials.