Heat Tolerant Turnkey No-Clean OEM Core Control Module PCB Assembly

Heat Tolerant Turnkey No-Clean OEM Core Control Module PCB Assembly. Turnkey End-to-End Service: Comprehensive solution from PCB design, component sourcing, assembly to box building and packaging. Massive Assembly Capacity: SMT capacity of 30 million points/day and DIP capacity of 100,000 pieces/day with scalable options. Medical Grade Quality Standards: Meets IPC-A-610 Class 2/3 and ISO 13485:2016 standards for critical medical applications. Full Traceability System: Complete barcode and MES traceability covering component batches, processes, and operators. Advanced Testing Capabilities: Includes 3D SPI, 3D AOI, X-ray, Flying Probe, ICT, FCT, and Burn-in tests for reliability. No MOQ Restriction: Supports both prototype and mass production without minimum order quantity limits. Customized Services: Offers full customization from samples and designs, including BOM analysis and conformal coating.