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High-Density Encapsulated Integrated Circuit Leadframe Tin Plating Equipment
4.0InStock Source-listed auditby Dongguan Allmerit Technology Co., Ltd.
₹1,67,00,000≈ $200,000 · indicative, confirm with supplier
Payment
Description
High-Density Encapsulated Integrated Circuit Leadframe Tin Plating Equipment, Find Details and Price about Tin Plating Leadframe Plating from High-Density Encapsulated Integrated Circuit Leadframe Tin Plating Equipment - Dongguan Allmerit Technology Co., Ltd.
Specifications
Speed3-12m/Min
OriginDongguan, Guangdong
Warranty1 Year
Model NO.AMT
TrademarkAllmerit
Package Size12000.00cm * 2360.00cm * 2630.00cm
CertificationISO
SpecificationCustomized
Specifications1-2 Channels
Spray MaterialElectronic
Shipping MethodSea Shipment
Material of TankPP/PVC/CPVC/Stainless Steel
