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Soft Thermally Conductive Pad Customize Heat Dissipation Gap Filler for Computer
4.0InStock Source-listed auditby GUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD.
₹8≈ $0.1 · indicative, confirm with supplier
Payment
L/C, T/T, D/P, Western Union, Paypal, Money Gram
Port
Shenzhen, China
Incoterms
CIF, DDP, CIP, Others
Description
Soft Thermally Conductive Pad Customize Heat Dissipation Gap Filler for Computer, Find Details and Price about Thermal Pads Thermal Silicone Pad from Soft Thermally Conductive Pad Customize Heat Dissipation Gap Filler for Computer - GUANGDONG DONGSEN ZHICHUANG TECHNOLOGY CO., LTD.
Specifications
OriginChina
Density1.8-5g/Cc
HS Code35069900
Hardness10-70 Shore C
Model NO.Heat cooling thermally pad
TrademarkTOUSEN
Package Size15.00cm * 15.00cm * 5.00cm
Specification200*400/330*300/custom
Breakdown Voltage5000-7000VAC/mm
Transport PackageCustom
Continuous Use Temp-40 to 300
Production Capacity500000
